material A in contact with the insulated boundary needs to below 90 °C, so that the material A can be stable
is applied to material A such that 15 W/cm is generated as heat. The surface temperature T, of the
conductivity of k, = 20 W/(mK). The back side of material A is thermally insulated. Electrical current
and do not melt. Material B is 0,3 cm thick and has a thermal conductivity of k, = 30 W/(mK). The
surface of solid B is exposed to air. The surface temperature, 7,, of material B is 70 °C. The bulk air
a) Use shell balance to derive the following temperature profile of material A. The process is at steady
temperature, T, is constant at 25 °C.
state.
T=-
-x² + ₂x + G₂
b) Determine the constants G₁ and C₂. Clearly show the boundary conditions used.
c) What is the heat flux? Unit must be in SI unit.
e)
d) Determine the temperature T, (unit in °C) at the interface of materials A and B.
of the flowing a
Determine the temperature T, (unit in °C) at x = 0 of the insulated surface.
Q™
2KA
Fig: 1