2. Consider the following electron emission type pressure sensor device. It is made by using wafer-bonding technology. The device is finalized by bonding two components (emitter membrane to the collecting plate). Give detailed processing steps of this device. (Working Mechanism: When you apply a high voltage, electrons emit from the micro tip to the bottom plate. The electron current (A) is proportional to the vacuum level of the Chamber. That way, if you calibrate the electron current with vacuum, you can measure the pressure of vacuum.This kind of sensors are good to measure high vacuum levels: 10*-10 Pa)

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