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An array of electronic chips is mounted within a sealed rectangular enclosure, and cooling is implemented by attaching an aluminum heat sink (k = 180 W/m - K).The base of

the heat sink has dimensions of w = w2 =100 mm, while the 6 fins are of thickness t 10 mm and pitch S = 18 mm. The fin length is L, = 50 mm, and the base of the heat sink has a thickness of L, = 10 mm.

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