MEEN 3310 HEAT TRANSFER Design Project Spring 2024 Design of a Computer Chip Liquid Cooling System for AI Computing Facilities This assignment requires a collaborative effort and is recommended to be undertaken in teams. It is the responsibility of students to form their own teams, with a strict limit of up to four members in each team. A one-student team is still allowed but not suggested. Overview This project requires designing a liquid cooling system for computer chips, with a focus on applications within AI computing facilities. The challenge is to create a system that efficiently manages the high heat output associated with intensive computational tasks in AI development, ensuring optimal performance and reliability of computing hardware. The significance of this design project is underscored by the demanding thermal management needs of AI computing facilities. Given the high thermal densities generated by AI algorithms and processes, these environments require advanced cooling solutions to maintain system stability and performance. Project Objectives 1. Design Suitability: Develop a cooling system that meets the specific needs of AI computing, optimizing for efficiency, reliability, and sustainability. 2. Design Procedure: Outline a clear and logical design process, from initial research to final solution, emphasizing innovative approaches to liquid cooling. 3. Alternatives Development: Explore various cooling technologies and configurations, providing a comparative analysis to justify the selected design. 4. Final Solution Justification: Demonstrate the effectiveness of the chosen design through simulations, calculations, or empirical data, focusing on its application in AI computing environments. 5. Consideration of Factors: Address how the design impacts public health, safety, and welfare, along with its environmental, social, and economic implications, particularly in the context of AI computing. 6. Engineering Standards and Codes: Adhere to relevant ASHRAE, IEEE, and ISO standards, ensuring the design is safe, efficient, and compliant with industry best practices. 7. AI-specific Considerations: Discuss the unique requirements of AI computing facilities, such as high thermal loads and the need for stable operating conditions under continuous, intensive computational workloads. Project Deliverables (1) Report (80%): The report must include a detailed design process (schematics, CAD drawings, and materials list), an analysis of alternatives (supporting the design choice with calculations), the final design choice, and its justification, with an emphasis on AI computing applications. It must also include one section for each item of the Project Objectives. (2) Presentation Slides and 5-minute Video (20%): Summarizing (a) key design aspects and decision-making process, (b) consideration of factors, and (c) engineering standards and codes.

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