c why we have to use low dielectric constant materials for isolating i
V a) Compute the sheet resistance of a 0.2 micron thick aluminum wire with resistivity 0.02 micro ohm.m. Find the resistance of the wire if it is 0.2 micron wide and 1 mm length. b) What is the parallel plate capacitance of wire if it is isolated from substrate with oxide thickness 0.2 micron. c) Why we have to use low dielectric constant materials for isolating interconnects. c) Why we have to use low dielectric constant materials for isolating interconnects. d) Find the interconnect delay for the above interconnect. d) Determine the skin depth for the above wire for pulse propagating with an of 30 psec.edge rate e) Does the interconnect delay depend on temperature? Does it increases or decreases with increase in temperature.
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